Solution deposition of inorganic materials and electronic devices made comprising the inorganic materials

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United States of America Patent

PATENT NO 8679587
APP PUB NO 20070184576A1
SERIAL NO

11564759

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Abstract

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Disclosed embodiments concern solution deposition of at least a first inorganic compound on a substrate, typically for production of electronic devices, such as solution deposition of metal salts, including halides, carbonyls, acetates, sulfates, phosphates, carbonates, and mixtures thereof. Solutions may be deposited using any suitable process, particularly inkjet printing or spin coating. The method can involve depositing only a first solution, depositing a first solution plural times, or deposition of plural different solutions. Furthermore, the method may involve simultaneous or serial deposition of two or more solutions. The method may further comprise post deposition processing the deposited material, such as thermal annealing, oxidation processes, reduction processes, exchange reactions, and combinations thereof. Electronic devices that can be made by the method also are described, including transistors, circuits, capacitors, photovoltaics, photodetectors, such as a UV detector, gas sensors, batteries, X-ray imagers, light emitting diodes, solid electrolytes, computer readable media, and combinations thereof.

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Patent Owner(s)

Patent OwnerAddress
THE STATE OF OREGON ACTING BY AND THROUGH THE STATE BOARD OF HIGHER EDUCATION ON BEHALF OF OREGON STATE UNIVERSITY312 KERR ADMINISTRATION BUILDING OFFICE OF TECHNOLOGY TRANSFER CORVALLIS OR 97331-2140

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chang, Chih-hung Corvallis, US 111 1091
Chang, Yu-Jen Corvallis, US 48 236
Lee, Do-Hyoung Corvallis, US 2 10

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