Dual heat spreader panel assembly method for bumpless die-attach packages, packages containing same, and systems containing same
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United States of America Patent
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May 25, 2010
Issued Date -
N/A
app pub date -
Sep 1, 2006
filing date -
Sep 1, 2006
priority date (Note) -
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Abstract
A process includes mating a first heat spreader and a second heat spreader, such that the first heat spreader at a mating surface and second heat spreader at a mating surface become parallel and adjacent. The process includes placing a first die in a first die recess of the first heat spreader, and placing a second die in a second die recess in the second heat spreader. The process includes reflowing thermal interface material between each die and respective heat spreader. Thereafter, the process includes separating the first heat spreader and the second heat spreader. A package is achieved by the process, with reduced thicknesses. The package can be disposed onto a mounting substrate. The package can be assembled into a computing system.
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