Chip-to-chip optical interconnect
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United States of America Patent
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May 13, 2008
Grant Date -
Dec 27, 2007
app pub date -
Jun 13, 2006
filing date -
Jun 13, 2006
priority date (Note) -
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Abstract
A chip-to-chip optical interconnect includes a substrate, an optoelectronic die, and a waveguide structure. The substrate includes an optical via passing through the substrate. The optoelectronic die is disposed on the substrate and aligned to optically communicate through the optical via. A waveguide structure is positioned proximate to the substrate and aligned with the optical via to communicate optical signals with the optoelectronic die through the optical via.
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