Cutting and sorting automation system and method for manufacturing a liquid crystal device using the same
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United States of America Patent
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-
Jun 10, 2003
Grant Date -
Nov 21, 2002
app pub date -
Jun 9, 1999
filing date -
Nov 26, 1998
priority date (Note) -
In Force
status (Latency Note)
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Abstract
Disclosed are a system for workpiece cutting and sorting automation, and a method for controlling the system. The system includes a cutting/sorting equipment for cutting a substrate having a plurality of cells into cut substrates, and sorting the cut substrates according to a predetermined mode; and a system controller for receiving a request for operation information on the cut substrates from the cutting/sorting equipment, and transmitting the operation information and operation commands to the cutting/sorting equipment. The method includes the steps of (a) determining an operating mode of the cut substrates; (b) sorting the cut substrates and supplying the sorted cut substrates to one of the plurality of cassettes according to the operating mode of the cut substrates determined in step (a); and (c) repeating steps (a) and (b) for a predetermined lot number of cut substrates.
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