Method for stud pull test for film formed on semiconductor device
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United States of America Patent
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Jan 23, 2001
Grant Date -
N/A
app pub date -
Jun 14, 1999
filing date -
Jun 14, 1999
priority date (Note) -
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Abstract
A test sample with a film and an underlying substrate representing part of a semiconductor wafer is prepared for a stud pull test by a process that includes maintaining the sample in boiling salt water for a few hours. When an epoxy stud is attached to the film of the sample and the clamped assembly is baked for a about an hour, the stud is firmly attached to the film and in an otherwise conventional pull test, the film breaks loose from the substrate (or the stud breaks from the epoxy) before the stud breaks from the film.
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