High-frequency electronic package with arbitrarily-shaped interconnects and integral shielding
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United States of America Patent
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Oct 24, 2000
Grant Date -
N/A
app pub date -
Jul 31, 1998
filing date -
Jul 31, 1998
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A surface mountable high frequency electronic package consisting of substrates stacked on top of each other, with arbitrarily-shaped solder structures such as balls and walls connecting them together; forming a fully-shielded, environmentally-sealed, sandwich in which smaller electronic components and devices are placed. In addition to providing electronic and mechanical interconnection to a mother substrate, the solder structures also provide electromagnetic isolation and shielding, controlled-impedance transmission line structures, and an environmental seal. The entire package is fabricated from conventional materials and components assembled together with automated processes.
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