Airflow Heatsink For Led Devices
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United States of America Patent
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Issued Date -
Aug 25, 2016
app pub date -
Sep 12, 2013
filing date -
Sep 12, 2013
priority date (Note) -
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Abstract
Disclosed is an LED lighting system with improved airflow and heat dissipation qualities. In one embodiment, the system comprises a heatsink mounted to an LED chip, and a fan assembly blowing air into the heatsink. The fan assembly includes a plurality of fans, the wind tunnels of the plurality of fans providing greater airflow in the center of the heatsink than a conventional one-fan configuration. In a further aspect, the disclosed system comprises a light head assembly in which cool air enters the light head assembly via the bottom and rear, and hot air is drawn out of the top of the light head assembly. An airflow path is created by selectively placing fans, baffles, walls, and openings in the lighting assembly.
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