METHODS OF FORMING A THIN TIM CORELESS HIGH DENSITY BUMP-LESS PACKAGE AND STRUCTURES FORMED THEREBY
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United States of America Patent
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Issued Date -
Mar 26, 2009
app pub date -
Sep 25, 2007
filing date -
Sep 25, 2007
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
Methods of forming microelectronic device structures are described. Those methods may include placing a plurality of support rings onto a tacky layer of a support carrier, wherein the support rings are disposed within a cavity of the support carrier; placing a plurality of thin die onto a pedestal of the support carrier, wherein a top surface of the thin die is substantially flush with at top surface of the support ring; and then building up layers on the top surface of the die.
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