Dual-chip integrated heat spreader assembly, packages containing same, and systems containing same
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United States of America Patent
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Feb 9, 2010
Grant Date -
Apr 3, 2008
app pub date -
Sep 29, 2006
filing date -
Sep 29, 2006
priority date (Note) -
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Abstract
A method includes mating a first heat spreader and a second heat spreader, such that the first heat spreader at a mating surface and second heat spreader at a mating surface become parallel and adjacent. The mated first heat spreader and second heat spreader have at least one convection channel disposed therebetween. A process includes placing a first die in a first die recess of the first heat spreader, and placing a second die on a second die site on the second heat spreader. The process includes reflowing thermal interface material between each die and respective heat spreader. A package is achieved by the method, with reduced thicknesses. The package can be coupled through a bumpless build-up layer. The package can be assembled into a computing system.
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